While this usually isn’t a problem with a linear profile, it can be much more challenging to create saddle profiles. The systems also have increasingly better insulation to counteract rising energy costs so that less heat is released into the environment and instead remains in the system. The maximum temperature difference between the temperature levels in the adjacent zones is bound to technical and physical limits here. In order to achieve the best soldering result, this temperature profile specifies how much and when thermal energy must be supplied to the respective assembly in accordance with a precisely defined schedule. From temperature profile to temperature control system While a linear profile assembly is heated with exactly the same linear temperature increase, the saddle profile is gradually heated to the desired temperature according to predefined temperature ranges. Heating zones which can be regulated separately, a reproducible temperature profile, stable processes at the lowest temperature differences or homogenous heat input provided by special nozzle holes: the Vision series’ convection soldering systems by Rehm Thermal Systems provide the basis for the best soldering results with their optimum heat transfer properties and enable simple and reproducible profiling, including in the form of a saddle profile or linear profile. Ishak, Study on copper pillar bump in flip chip technology using computational fluid dynamics, in International Invention & Innovative Competition (InIIC), (2020), pp.Stable reflow soldering procedures with Rehm’s Vision series Lu, Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process, in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (2018), pp. Zhao, Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps. Zhang, Design optimization of pillar bump structure for minimizing the stress in brittle low K dielectric material layer. Hong, Structural design guideline for Cu pillar bump reliability in system in packages module, in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (2016), pp. Chai, Characterization and modeling of fine-pitch copper ball bonding on a Cu/Low-k chip. Yusop, Finite element analysis on the effect of solder joint geometry or the reliability of ball grid array assembly with flexible and rigid PCBS. Adam, Effects of temperature on the wave soldering of printed circuit boards: CFD modeling approach. Che Ani, CFD modeling of pin shape effects on capillary flow during wave soldering. Ahmad et al., Investigations of infrared desktop reflow oven with FPCB substrate during reflow soldering process. Khor, A review on numerical approach of reflow soldering process for copper pillar technology. Che Ani, Influence of printed circuit board thickness in wave soldering. Abdul Aziz, et al., Finite volume-based simulation of the wave soldering process: influence of the conveyor angle on pin-through-hole capillary flow. Khor, Influence of PTH offset angle in wave soldering with thermal-coupling method. Khor, Thermal fluid-structure interaction of PCB configurations during the wave soldering process. Saad, Experimental and numerical investigation of 3D gas flow temperature field in infrared heating reflow oven with circulating fan. Shin, Thermal response of electronic assemblies during forced convection-infrared reflow soldering in an oven with air injection. Whalley, A simplified reflow soldering process model. Khor, Numerical investigations on the effects of different cooling periods in reflow-soldering process. Mohamad (IntechOpen, London, United Kingdom, 2017), pp. Weng, Chapter 5 Evolution of Pb-free solders, in Recent Progress in Soldering Materials, ed. Nawaz, Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study. Lau, Chapter 2 Flip chip technology versus FOWLP, in Fan-Out Wafer-Level Packaging (Springer, Singapore, 2018), pp. Lau, Recent advances and new trends in flip chip technology. Gu, Accelerate the Development of Advanced IC Packages Using 3D X-ray Microscopes to Measure and Characterize Buried Features (2019)
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |